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晶升股份融资融券信息显示，2023年5月18日融资净偿还196.8万元；融资余额6052.53万元，较前一日下降3.15%
融资方面，当日融资买入1768.81万元，融资偿还1965.61万元，融资净偿还196.8万元。融券方面，融券卖出23.46万股，融券偿还27.86万股，融券余量98.96万股，融券余额4433.43万元。融资融券余额合计1.05亿元。
晶升股份融资融券交易明细（05-18）
晶升股份历史融资融券数据一览
免责声明：本文基于大数据生产，仅供参考，不构成任何投资建议，据此操作风险自担。
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